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| Segotep CVN X570M PRO V14 Micro ATX Gaming Motherboard |
Segotep CVN X570M Gaming PRO V14 Micro ATX Gaming motherboard AMD X570M Ryzen 2.3 Processors AM4 DDR4 / SATA 3.0 / M.2 / DP HDMI / USB 3.1 / 2-way AMD Crossfire & iGame Dynamic Light
Excellent performance from Ryzen Series 2 processors
With AMD X570M chipset, the CVN X570M GAMING PRO V14 supports Ryzen 2000/3000 processors. It's great for gaming, office work, or dedicated computer use.
High-speed M.2 gearbox
Two M.2 slots use PCI-E 4.0 channels to transfer data and can use SSDs that support the NVMe protocol. Compared to traditional M.2 slot, data transfer rate doubles, and gaming burden remains elusive.
DDR4 data transfer is reliable
Segotep CVN X570M GAMING PRO V14 motherboard has 4 DDR4 slots, more reliable transmission specifications, better data reliability and higher energy efficiency.
Audio chip + HIFI audio chip protection
Eliminate distractions and preserve the integrity of the audio signal to give users a pure, high-fidelity audio experience while performing, working or entertaining.
RTL8118A-CG Sports Network Card
Effectively protect the network stability and avoid the interference from complex circuits and electromagnetic waves in the network
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| Segotep CVN X570M PRO V14 Micro ATX Gaming Motherboard |
- Support for AMD AM4 processors with Ryzen 2000 and 3000 socket;
- 4 DIMM slots, supports dual-channel DDR4 memory when using Ryzen 2000 processors, supports 2933/2800/266/2400/2133 MHz memory, supports DDR4 4000+ (OC) / 3800 (OC) / 3600 (OC) / 3200 / memory 3000/2933/2800/2666/2400/2133 MHz.
- 1 PCI Express 4.0x16, 1 PCI Express 4.0x4 (supports AMD CrossFire 2 lanes); 6 xSATA3.0 6Gb / s ports; 1 x PCI Express 4.0 x 1 slot, 2 xM.2 slots (supports MSATA and PCI-e Gen4 x4 SSDs).
- The color and heat dissipation cover with red ring metal power center and wire drawing technology bring out the beauty of CVN. The heat dissipation area on the heat dissipation cover is larger, allowing the contact with air to be expanded, thus achieving higher heat dissipation performance.
- Materials with high thermal conductivity can improve the heat dissipation capacity of the power source, memory and chipset. Energy Core cooling hood provides more heat dissipation area on the cooling hood to expand air connection and achieve more cooling performance.